论文部分内容阅读
高速运动精密定位是微电子封装设备中高加速轻载执行机构的基本运动需求。本文推导了高加速机构瞬态非线性动力学响应方程,揭示了刚度、频率、阻尼(与材料空间布局相关)和驱动频率(与运动规划相关)是主要影响因素。据此,在满足高加速机构精密定位的条件下,笔者提出了一种基于最优非线性动力学响应的结构优化和速度规划新方法。在结构优化中,首先分析了目前流行的基于等效静态载荷的柔性多体动力学优化方法耒充分考虑惯性载荷的不足,然后提出了基于等效模态的柔性多体动力学最优动态响应优化新方法;在速度规划上,针对传统的几何光滑方法不能反映系统动态特性的缺陷,提出了基于变边界条件非线性动力学响应优化的速度规划新方法。将所提方法应用到高速固晶焊头的优化设计中,通过结构优化,降低振幅超过20%,再经非对称变加速规划,缩短定位时间超过40%。本文提出的方法为微电子封装类装备等高加速轻载机构精密定位的实现提供了有效的理论支撑和解决途径。
High-speed motion Precise positioning is the basic motion requirement for high-acceleration light-load actuators in microelectronic packaging equipment. In this paper, the transient nonlinear dynamic response equation of high accelerating mechanism is deduced. It is revealed that stiffness, frequency, damping (related to material spatial layout) and driving frequency (related to motion planning) are the main influencing factors. Therefore, under the condition of meeting the precise positioning of high accelerating mechanism, a new method of structural optimization and speed planning based on the optimal nonlinear dynamic response is proposed. In structural optimization, the current popular flexible multi-body dynamic optimization method based on equivalent static load is analyzed, and the insufficiency of inertial load is fully considered. Then, the optimal multi-body dynamic dynamic response based on equivalent modes In the aspect of speed planning, aiming at the defect that the traditional geometric smoothing method can not reflect the dynamic characteristics of the system, a new speed planning method based on the variable boundary condition nonlinear dynamic response optimization is proposed. The proposed method is applied to the optimization design of high-speed solid-state welding head. Through structural optimization, the amplitude is reduced by more than 20%, and then the asymmetric variable-speed programming can shorten the positioning time by more than 40%. The method proposed in this paper provides an effective theoretical support and solution for the realization of precision positioning of high-speed light-load mechanism such as microelectronic packaging equipment.