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4.装配MOS LSI电路在分离器件中出现的所有与装配有关的失误形式,包括接头、管芯接触、密封性、引线的疲劳和封壳中间的问题,同样在LSI器件中也都发生。LSI器件包括有更多的外部导线和内部接头,因此比分离器件在封装上更大些。大的密封的双列直插封装具有较小的厚度/长度比,当操作时容易弯曲致损。LSI的封装要足够坚固,能耐住生产者和使用者的正常操作以及根据MIL-STD-883要求将遇到的周围环境和机械应力。但是粗心地操作仍可能使密封损坏而造成漏气或电路断开。而当外部导线和内部接头的数量很大时,用于密闭封装封口用的盖就比较大,这增加了漏气的机率和电路断开
4. Assembling MOS LSI Circuits All the assembly-related errors that occur in discrete devices, including connectors, die contact, tightness, lead fatigue, and the middle of the package, also occur in LSI devices. LSI devices include more external leads and internal contacts and are therefore larger on the package than the discrete devices. Large sealed dual in-line package has a smaller thickness / length ratio, easy to bend when operating damage. The LSI package is robust enough to withstand the normal operation of the producer and user as well as the ambient and mechanical stresses to be encountered in accordance with MIL-STD-883 requirements. However, careless operation may still cause damage to the seal resulting in air leaks or disconnection of the circuit. When the number of external leads and internal connectors is large, the cover for hermetically sealed packages is larger, which increases the probability of leaks and disconnects the circuit