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无铅焊料熔点高、工艺窗口小,建立了PCB(印刷电路板)组件在回流焊接传热过程的数学模型,采用ANSYS软件模拟得出无铅焊料PCB组件温度场和热变形的分布规律,通过改变传送带速度对仿真结果进行了优化,最高温度降低了21℃,整体变形有所降低。
The melting point of lead-free solder is high and the process window is small. The mathematic model of PCB (printed circuit board) component in reflow soldering heat transfer process is established. The distribution of temperature field and thermal deformation of lead-free solder PCB component is simulated by ANSYS software. Change the conveyor speed to optimize the simulation results, the maximum temperature decreased by 21 ℃, the overall deformation has decreased.