论文部分内容阅读
掩模是混合和集成电路制作时最基本过程。通常,掩模加工过程是材料淀积、扩散或腐蚀。由于在制作单个电路和连线时,这样的加工过程要进行几次。制作掩模的标准方法是采用计算机辅助设计(CAD)台进行图形设计和布线。然后,CAD台的图形数据馈入到绘图器内,产生大规模的掩模图形。这些图形用照相的方法缩小,并把它转送到玻璃基片上。这个过程包含若干阶段,其中中间胶片的处理就要几周。Texas A&W大学的研究人员已取消了中间照相阶段,其中把CAD台与激光微调系统接口。结果是在几小时内得到1:1厚膜或10:1薄膜的光掩模产品。
Masks are the most basic process for making hybrids and integrated circuits. Normally, the mask process is material deposition, diffusion or erosion. Because in the production of a single circuit and connection, this process to be carried out several times. The standard way to make masks is to use a computer aided design (CAD) desk for graphic design and wiring. The CAD data is then fed into the plotter to produce a large scale mask pattern. These figures are reduced by photographic methods and transferred to a glass substrate. This process involves several stages, with the intermediate film taking weeks to process. Researchers at Texas A & W University have canceled the intermediate photography phase, where the CAD stage is interfaced with a laser trimming system. The result is a photomask product that yields a 1: 1 thick film or a 10: 1 thin film in a matter of hours.