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LED电极结构极大地影响着LED芯片的电流扩展能力,优化电极结构,能够缓解电流拥挤现象。讨论了正装LED结构和倒装LED结构的电流分布模型,并通过SimuLED软件研究了电极结构对LED电流扩展能力的影响。仿真结果表明:采用插指型电极结构极大提高了正装LED的电流扩展能力,电极下方插入电流阻挡层(CBL)后改变了芯片的电流分布状况,有利于光效的提升;而倒装LED的通孔式双层金属电极结构利用两层金属的互联作用,使n电极能够在整个芯片范围内均匀分布,进一步提高了电流扩展性能。
LED electrode structure greatly affects the LED chip current scalability, optimizing the electrode structure, can ease the current crowding phenomenon. The current distribution model of LED structure and LED structure was discussed. The influence of electrode structure on the LED current spreading capability was studied by SimuLED software. The simulation results show that the finger-type electrode structure greatly improves the current spreading capability of the LED, and the current blocking layer (CBL) is inserted below the electrode to change the current distribution of the chip, which is in favor of improving the light efficiency. The flip-chip LED The through-hole double-layer metal electrode structure utilizes the interconnection of two layers of metal to allow the n-electrode to be uniformly distributed over the entire chip area, further improving the current spreading performance.