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美国Ohmtec公司改革印刷电路板的制造工艺,用印刷法代替化学淀积或腐蚀法。可以完全不用腐蚀和镀铜所需的化学药品,也免了处理废酸等物的麻烦。 受市售丝网的尺寸限制,现在印制的这种电路板的大小是4时×6时。每小时可生产约1000—1500块。 这种电路板可做成单层或双层。双层电路板的两个导电层印在板的同一面,中间用绝缘层隔开。两层之间需要联接的地方没有绝缘层。这种办法可免去一块板的两面做电路,中间用镀铜的小孔联接而产生的不可靠
Ohmtec US companies to reform the manufacturing process of printed circuit boards, printing method instead of chemical deposition or corrosion. The chemicals needed for corrosion and copper plating can be dispensed with, and the trouble of disposing waste acid and the like is also avoided. Limited by the size of commercially available screens, the size of this printed circuit board is now 4 × 6. About 1000-1500 pieces can be produced per hour. This circuit board can be made single or double. The two conductive layers of the double circuit board are printed on the same side of the board separated by an insulating layer. There is no insulation between the two layers where they need to be joined. This approach can be removed from the board on both sides of the circuit, the middle hole with copper plated connection is not reliable