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采用真空扩散焊接方法研究了同质及异质SiCp增强Al基复合材料的连接特性,考察了SiCp体积分数变化及插入中间合金层对同质及异质Al合金基复合材料真空扩散焊接质量及接头性能的影响.研究结果表明,无论同质还是异质Al合金基复合材料,真空扩散焊接头的强度均随SiCp体积分数的增加而降低;获得满意的异质SiCp增强Al合金基复合材料的真空扩散焊连接远比同质材料时困难。研究结果还表明,无论同质还是异质Al合金基复合材料的真空扩散焊,采用合适的中间合金层可以明显改善接头连接质量,扩散焊接头的强度明显高于无中间合金层的接头。
Vacuum diffusion welding method was used to study the bonding properties of homogeneous and heterogeneous SiCp reinforced Al matrix composites. The changes of the volume fraction of SiCp and the quality of the vacuum diffusion welding of the intermediate and heterogeneous Al matrix composites were investigated. The impact of performance. The results show that the strength of vacuum diffusion welded joints decreases with the increase of the volume fraction of SiCp, regardless of the homogeneous or heterogeneous Al-based alloy matrix composites. The satisfactory diffusion bonding of heterogeneous SiCp reinforced Al matrix composites is obtained More difficult than homogenous materials. The results also show that the joint quality can be improved obviously by using appropriate intermediate alloy layer, no matter whether the homogenous or heterogeneous Al-based alloy is vacuum-diffused. The strength of the diffusion welded joint is obviously higher than the joint without intermetallic layer.