键合点根部损伤是Al丝超声键合工艺中最常见的问题之一,严重的根部损伤不仅使焊点的键合强度降低,甚至会使键合点失效。本文通过优化键合机器的工艺参数,分析键合丝的组成成份和采取不同的退火条件,研究Al丝超声键合中键合点根部损伤的程度,为键合丝的选用提供依据,也为进一步提高Al丝超声键合强度做一些基础工作。 Bond root damage is Al wire ultrasonic bonding process is one of the most common problems, severe root damage not only reduces the bonding strength of solder joints, and even failure of the bond. In this paper, by optimizing the process parameters of the bonding machine, analyzing the composition of the bonding wire and adopting different annealing conditions, the damage degree of the bonding point in the Al wire ultrasonic bonding is studied to provide the basis for the selection of the bonding wire, Improve Al wire ultrasonic bonding strength to do some basic work.