论文部分内容阅读
对Cu/Mo/Cu板材进行了单道次复合轧制,研究了退火温度对Cu/Mo/Cu复合板微观组织和力学性能的影响。结果表明:退火温度对铜板的微观组织影响较大。随着退火温度的升高,复合界面处的细小晶粒分布趋于均匀;当温度高于400℃时,铜晶粒发生再结晶长大,组织粗化。随着退火温度的升高,复合板的结合强度逐渐升高;400℃时达到最大值76 MPa;温度继续升高时,结合强度迅速下降。复合机制主要为裂口结合机制。
The single pass rolling of Cu / Mo / Cu plate was carried out. The effect of annealing temperature on the microstructure and mechanical properties of Cu / Mo / Cu composite plate was studied. The results show that the annealing temperature has a great influence on the microstructure of copper plate. With the increase of annealing temperature, the distribution of fine grains in the composite interface tends to be uniform. When the temperature is higher than 400 ℃, recrystallization and growth of copper grains occur and the microstructure becomes coarse. With the increase of annealing temperature, the bonding strength of the composite board gradually increased, reaching the maximum value of 76 MPa at 400 ℃. When the temperature continued to increase, the bonding strength decreased rapidly. The main mechanism for the combination of rips mechanism.