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采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)及高分辨率透射电子显微镜(HRTEM)对Cu-3Ti-5Ni合金深冷处理前后的组织演化及析出相进行了表征分析,采用维氏硬度计、涡流电导仪分别分析了深冷处理对合金硬度和导电率的影响。结果表明,Cu-3Ti-5Ni合金经深冷处理后,析出细小颗粒相,Ni3Ti第二相析出更完全。TEM分析发现深冷处理后针状Ni3Ti析出相的周围出现了位错的缠绕,基体中的位错线向位错环转换。适当时间的深冷处理可有效提高Cu-3Ti-5Ni合金的硬度,经深冷处理15 h后合金硬度达最大值217 HV10,但深冷处理对合金导电率的影响甚微。
The microstructures and precipitates of Cu-3Ti-5Ni alloy before and after cryogenic treatment were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and high resolution transmission electron microscopy (HRTEM). Vickers hardness Meter, eddy current conductivity meter were analyzed the effect of cryogenic treatment on the hardness and conductivity of the alloy. The results show that after the cryogenic treatment of Cu-3Ti-5Ni alloy, the precipitated fine particle phase, Ni3Ti second phase precipitation more completely. TEM analysis showed that there was dislocation entanglement around the precipitated Ni3Ti phase after cryogenic treatment, and the dislocation lines in the matrix transformed into dislocation loops. The cryogenic treatment at the proper time can effectively improve the hardness of Cu-3Ti-5Ni alloy. The hardness of Cu-3Ti-5Ni alloy reaches as high as 217 HV10 after cryogenic treatment for 15 h, but the cryogenic treatment has little effect on the conductivity of the alloy.