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对SiO2/聚氨酯丙烯酸酯(PUA)-环氧丙烯酸酯(EA)复合材料及PUA-EA纯树脂体系进行热失重及热分解DSC对比分析。结果表明,SiO2/PUA-EA热分解开始温度为143.8℃,在320℃出现大量失重现象,均高于PUA-EA体系。SiO2/PUA-EA作为光栅涂层与裸纤和纯树脂涂层相比,更能准确监测复合材料固化过程,并且SiO2/PUA-EA固化后残余应力约为128kPa,低于之前报道。SEM显示,SiO2/PUA-EA与光纤内核之间结合良好,未出现分层现象。
Comparative Analysis of Thermogravimetric and Thermal Degradation of SiO2 / Polyurethane Acrylate (PUA) - Epoxy Acrylate (EA) Composite and PUA - EA Pure Resin System. The results showed that the starting temperature of thermal decomposition of SiO2 / PUA-EA was 143.8 ℃, and a large amount of weight loss appeared at 320 ℃, which was higher than that of PUA-EA system. Compared with bare fiber and pure resin coating, SiO2 / PUA-EA can accurately monitor the curing process of composite materials, and the residual stress of SiO2 / PUA-EA after curing is about 128kPa, lower than previously reported. SEM showed that there was no delamination between SiO2 / PUA-EA and optical fiber core.