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近年来,国外由于对军事技术和空间研究的需要,研制了性能优良,具有高度可靠性的金铂导电带系列。并且已供实用。然而,金铂导电带在烧成过程中的详细机理,以及导电带的结构与性能之间的关系等问题,尚未见到系统的研究报导。本文以金铂导电带作为研究对象,采用自制的金粉,铂粉和玻璃釉粉等材料。应用X射线衍射,电子探针,电子显微镜和热差重等分析手段,对上述导电带的烧结过程进行了研究。基本查明了导电带的生成机理和烧结温度引起结构变化对导电带的主要性能的影响等关系问题。
In recent years, due to the need of military technology and space research abroad, foreign countries have developed a series of gold-platinum conductive tapes with excellent performance and high reliability. And has been practical. However, the detailed mechanism of the Au-Pt conductive tape in the firing process and the relationship between the structure and the performance of the conductive tape have not been reported yet. In this paper, gold and platinum conductive tape as the research object, using homemade powder, platinum and glass glaze powder and other materials. The sintering process of the conductive tape was studied by means of X-ray diffraction, electron probe, electron microscope and thermal gravimetric analysis. Basic found out the formation mechanism of the conductive tape and sintering temperature caused by structural changes on the main performance of the conductive tape and other issues.