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为减少焊接前期工作量以及降低成本,采用正交试验法对Sn-Bi焊料用助焊剂中溶剂成分进行了优化设计。以焊膏铺展性能和焊点形貌作为评价指标,对单一溶剂和复配溶剂进行优选。结果表明:单配溶剂制备得到的焊膏铺展性能差、焊点不规则,残留物多;而复配溶剂制备得到的焊膏铺展率较大,焊点外形饱满、表面氧化物少。X醇、异戊醇、Y醚的比例为2:1:2时铺展率可达83.18%。焊料的微观组织分析也表明,在最优条件下的焊料在铜基板上铺展好,且焊缝界面区域无缺陷,助焊效果良好。
In order to reduce the amount of pre-welding work and reduce the cost, orthogonal experiment was used to optimize the solvent composition of Sn-Bi solder flux. Taking solder paste spreadability and solder joint morphology as evaluation indexes, single solvent and compounding solvent are optimized. The results show that the solder paste prepared with a single solvent has poor spreadability, irregular solder joints and more residues, while the solder paste prepared by the compounding solvent has a large spreading rate, full solder point appearance and few surface oxides. X alcohol, isoamyl alcohol, Y ether ratio of 2: 1: 2 spreading rate of up to 83.18%. The microstructure analysis of the solder also showed that the solder under optimal conditions spread well on the copper substrate, and the weld interface area has no defects and the fluxing effect is good.