在市场低迷、IT业界竞争激烈的情况下,为降低生产成本,一些主要半导体厂商均积极投入12英寸晶圆厂的兴建工作,半导体业界也可望于2003年正式步入12英寸晶圆量产阶段。在工艺技术方面,现阶段12英寸晶圆仍以0.13微米技术为主,不久的将来可转向0.09微米、甚至于0.07～0.05微米工艺发展,届时半导体生产也将正式迈入纳米时代。 In the downturn, the IT industry is fiercely competitive, in order to reduce production costs, some major semiconductor manufacturers are actively involved in the construction of 12-inch fabs, the semiconductor industry is also expected to formally enter the 2003 12-inch wafer production stage. In terms of technology, the current 12-inch wafer is still dominated by 0.13-micron technology and will be able to shift to 0.09-micron or even 0.07-0.05-micron technology in the near future. By then, semiconductor production will also officially enter the nano-era.