论文部分内容阅读
9209001 化学镀金——通用电子公司,美国专利(90.12.18) 化学沉积金的溶液组成为:0.002～0.05 mol/L碱金属的Au(Ⅰ)氰络合物,0.01～0.1 mol/L氰化物,0.1～1.0 mol/L碳酸盐和0.01～0.1 mol/L的碱金属的硼氢化物或硼氢化铵,pH为10～14。 9209002 超导体的化学镀金——美国专利4971944(90.11.20) 在含有碱土金属-铜氧化物的陶瓷氧化物超导体(SPC)上化学沉积金。通过添加金的氯化物到有机溶剂和适应于金氯化物的还原剂配制金溶液。在非水溶液中,连续不断地加入不起反应的物质到陶瓷氧化物中,用金溶液混合至SPC呈悬浊液,添加有
9209001 Electroless Gold Plating - General Electric Company, U.S. Patent (90.12.18) The chemical composition of the gold deposit is as follows: 0.002 to 0.05 mol / L of an alkali metal complex of Au (I), 0.01 to 0.1 mol / L of cyanide , 0.1 to 1.0 mol / L carbonate, and 0.01 to 0.1 mol / L alkali metal borohydride or ammonium borohydride at a pH of 10-14. 9209002 Electroless Gold Plating on Superconductors - U.S. Patent 4,971,944 (90.11.20) electrolessly deposits gold on ceramic oxide superconductors (SPC) containing alkaline earth metal-copper oxide. The gold solution is formulated by adding gold chloride to an organic solvent and to a gold chloride reducing agent. In a non-aqueous solution, the unreactive substance is continuously added to the ceramic oxide, mixed with SPC in a gold solution as a suspension, and added with