为求解硅基热沉大功率LED封装阵列在典型工作模式下的热传导情况,采用Solidworks建立了2×2封装阵列的三维模型,模拟了其温度场分布,同时结合传热学基本原理分析计算了模型各部分的温度值,并对实际工艺制备出的封装器件的结温进行了测量。结果表明,理论计算值与热仿真结果基本一致,测量值也能很好地与理论计算值相吻合。 In order to solve the heat conduction of high power LED package array under typical working mode, a 3 × 2 model of 2 × 2 package array was established by Solidworks to simulate its temperature field distribution. At the same time, the basic principle of heat transfer was analyzed and calculated The temperature value of each part of the model, and the junction temperature of the packaged device produced by the actual process was measured. The results show that the calculated results are basically the same as the thermal simulation results and the measured values ​​are in good agreement with the theoretical values.