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提出了一种高速光探测器封装优化设计的新方法。首先用矢量网络分析仪对封装寄生参量和探测器芯片进行准确测量 ,研究了探测芯片的本征参量与封装寄生参量之间的谐振现象 ,然后合理利用这种谐振效应对芯片的频率响应特性进行有效补偿。理论分析和实验结果都证明优化封装后器件的频率响应带宽超过了芯片的响应带宽。该方法不需要另加其它元件 ,而仅仅利用光电器件封装过程中必不可少的金丝所带来的寄生电感 ,就达到了改善器件频率响应特性的目的。
A new method of high-speed photodetector package optimization design is proposed. Firstly, the vector network analyzer is used to measure the package parasitic parameters and the detector chip accurately. The resonance phenomenon between the intrinsic parameters of the chip and the package parasitics is studied. Then the frequency response characteristics of the chip are reasonably utilized. Effective compensation. Both theoretical analysis and experimental results show that the frequency response bandwidth of the optimized package exceeds the response bandwidth of the chip. The method does not need additional components, and only utilizes the parasitic inductance brought by the indispensable gold wire in the optoelectronic device packaging process to achieve the purpose of improving the frequency response characteristic of the device.