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目前微电子与光电子芯片对散热要求日益增高,烧结式微热管已经成为其理想的散热元件,对微热管进行快速抽真空,使微热管中的工质量与真空度符合要求,是决定其制造质量与成本的重要因素。通过对微热管的工作原理及其抽真空-工质灌注-冷焊的制造方法进行分析,提出一种分别采用工质冻结-抽真空-冷焊法与二次除气-冷焊法对烧结式微热管进行抽真空的方法。大量的实验表明,采用所提出的制造方法不仅可以保证微热管中工质量与真空度达到要求,而且抽真空的时间大约比原有方法节省了2/3,具有很好的传热性能。
At present, microelectronics and optoelectronic chips are increasingly demanding in terms of heat dissipation. The sintered micro-heat pipe has become an ideal heat-dissipating component. The micro-heat pipe is quickly evacuated so that the working quality and degree of vacuum in the micro-heat pipe meet the requirements, which determine the manufacturing quality and The cost of an important factor. By analyzing the working principle of micro-heat pipe and the manufacturing method of vacuum-working-substance injection-cold welding, a new method is proposed that uses the method of working-material freezing-evacuation-cold welding and secondary outgassing- Micro-heat pipe vacuum method. A large number of experiments show that using the proposed manufacturing method can not only ensure that the quality and degree of vacuum heat pipe meet the requirements, and the vacuum time is about 2/3 of the original method, with good heat transfer performance.