一、引言硅片是半导体器件、集成电路的基本材料。努力完善加工工艺以获得优质无损抛光硅片是提高半导体器件和大规模集成电路成品率的重要一环。而在加工工艺中,抛光条件直接决定着硅片表面质量。因此,国内外对抛光工艺一直在不断的研究、改革和创新。其中无磨料抛光技术、无蜡抛光工艺技 First, the introduction of silicon is a semiconductor device, the basic material of integrated circuits. Efforts to improve the processing technology to obtain high-quality non-destructive polishing silicon is to improve the yield of semiconductor devices and large-scale integrated circuits an important part. In the processing technology, the polishing conditions directly determine the quality of the silicon surface. Therefore, the domestic and foreign polishing process has been constantly research, reform and innovation. One non-abrasive polishing technology, wax-free polishing technology