Effect of electromigration and isothermal aging on interfacial microstructure and tensile fracture

来源 :中国焊接：英文版 | 被引量 : 0次 | 上传用户：norn1

【摘要】

：

The Cu/Sn-3.OAg-0.5Cu/Cu butting solder joints were fabricated to investigate the evolution of the interfacial intermetallic compound(IMC) and the degradation o

【作者】

：

卫国强刘恒林杜隆纯姚健

【机构】

：

SchoolofMechanicalandAutomotiveEngineering

【出处】

：

中国焊接：英文版

【发表日期】

：

2016年3期

【基金项目】

：

This work was supported by National Natural Science Foundation of China （Grant No. NSFC-UO734006/NSFC-51371083）.

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The Cu/Sn-3.OAg-0.5Cu/Cu butting solder joints were fabricated to investigate the evolution of the interfacial intermetallic compound(IMC) and the degradation of the tensile strength of solder joints under the effect of electromigration(EM) and aging proc

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Effect of electromigration and isothermal aging on interfacial microstructure and tensile fracture

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