日本最近开发了在氮气环境中焊接印制电路板上引线元件的新技术。由于在氮气环境中焊接,抑制了焊料及基板的氧化作用,不仅提高了焊接电路板的强度及可靠性,而且焊后毋需用大量污染环境的且价格昂 Japan recently developed a new technology for soldering lead components on printed circuit boards in a nitrogen atmosphere. Due to the welding in a nitrogen environment, the oxidation of the solder and the substrate is suppressed, which not only improves the strength and reliability of the soldered circuit board, but also eliminates the need for a large amount of environmental pollution after welding and is expensive