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3D Numerical Simulation of Non-isothermal Resin Transfer Molding Filling Process Using Unstructured
【机 构】
：
National Engineering Research Center of Die and Mold CAD,Shanghai Jiaotong University,Shanghai 20003
【出 处】
：
上海交通大学学报（英文版）
【发表日期】
：
2010年6期
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