第一部分§1.概述目前由于电子设备的高速发展和国防建设事业的迫切需要,使得结构组成元件数繁多,排列密集,功率增大,因而设备在工作时产生大量的热量使得元件温度升高往往超过元件的允许温度,严重的影响了各元件的正常工作,使其性能变坏。因此为了保证设备的工作可靠,应根据具体情况,采用适当的冷却系统进行冷却。就当前看来,广泛用作冷却的有:自然散热,强迫风冷,强迫液冷,热管冷却,蒸发冷却,超蒸发冷却,半导体致冷。还 Part I. §1. Overview At present, due to the rapid development of electronic equipment and the urgent need of national defense construction, the components of the structure are numerous, densely arranged, and power is increased. Therefore, the device generates a large amount of heat during operation, which tends to increase the temperature of the component Exceed the allowable temperature of the component, have seriously affected the normal work of each component, make its performance worse. Therefore, in order to ensure the reliability of equipment, it should be based on the specific circumstances, the use of appropriate cooling system for cooling. For the moment it is widely used as cooling: natural cooling, forced air cooling, forced liquid cooling, heat pipe cooling, evaporative cooling, super-evaporative cooling, semiconductor cooling. also