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半导体器件(晶体二、三极管、可控硅、集成电路)是航空机载设备电子系统的重要组成部分。其功能可靠性直接影响或决定电子系统的可靠性。由于航空产品特殊的工作环境与较高的技术要求,使得半导体器件在工作状态要受到电应力、热应力、气候应力、机械应力等综合作用,这就决定了半导体器件的失效率要受到诸多负荷因素的影响。因此,器件的失效过程是一个多维、非平稳随机过程,由多种因素所决定。器件失效与工作负荷、内在工艺质量、环境条件、筛选工艺等因素有关。从实质上讲,航空用半导体器件的质量控制必须从器件的固有质量、器件的使用及器件的老化筛选三个主要环节加以控制。这三个环节具有内在联系,缺一不可。
Semiconductor devices (transistors, triodes, thyristors, integrated circuits) are an important part of the electronic system of airborne equipment. Its functional reliability directly affects or determines the reliability of electronic systems. Due to the special working environment and high technical requirements of aeronautic products, the semiconductor devices are subject to the combined effects of electrical stress, thermal stress, climate stress and mechanical stress in the working state, which determines that the failure rate of the semiconductor device is affected by many loads The impact of factors. Therefore, the device failure process is a multi-dimensional, non-stationary random process, determined by many factors. Device failure and workload, the inherent quality of the process, environmental conditions, screening process and other factors. In essence, the quality control of aeronautical semiconductor devices must be controlled from the inherent quality of the device, the use of the device, and the aging screening of the device. These three links are inherently linked, indispensable.