半导体设备大厂应用材料推出最先进的蚀刻技术—AppliedCenturaAvatar介电层蚀刻系统,这项突破性的系统是解决建立3D存储器架构的严峻挑战;3D存储器架构可提供高密度兆位元储存容量,为未来资料密集型移动装置所必需。应用材料表示,Avatar系统可在复合薄膜堆叠层中进行孔洞性蚀刻及沟槽性蚀刻,深宽比可高达80比1,单一制程能同时蚀刻出各种不同深度的结构,以 Introducing the state-of-the-art etching technology from Applied Semiconductor’s Applied Materials, AppliedCenturaAvatar dielectric etch system, this ground-breaking system addresses the challenge of building 3D memory architectures; the 3D memory architecture delivers high-density megabit storage capacity for Necessary for future data-intensive mobile devices. Applied Materials said that the Avatar system can perform both hole and trench etching in composite film stacks with aspect ratios up to 80 to 1, allowing for simultaneous etching of structures of varying depths in a single process