在电子工业中,人们已经充分地认识到器件封装的发展趋势是引脚的间距会越来越小,最终的结果将是采用芯片直接贴装。为了便于转到使用裸芯片进行装配,连接和保护芯片的材料应当适合于装配可靠性要求甚高的集成电路,提供这种材料乃是材料供应商当仁不让的工作。 In the electronics industry, people have fully realized that the trend of device packaging is that the pitch of the pins will become smaller and smaller, and the final result will be that the chip is directly mounted. In order to facilitate the switch to the use of bare chips for assembly, the material for connecting and protecting the chip should be suitable for the assembly of highly reliable integrated circuits, which is a material work for the material supplier.