论文部分内容阅读
对塑封器件进行破坏性物理分析(DPA),发现有样品芯片表面存在金属化层损伤。对损伤部位进行背散射电子成像和能谱分析,确定损伤部位存在钢颗粒。结合塑封封装工艺环节进一步分析损伤形貌,结果表明钢颗粒来源于塑封模具破损或老化,在环氧固化过程中产生的应力导致钢颗粒压碎金属化层。分析了具有这类缺陷的塑封器件在高可靠应用领域中的危害性。这类缺陷形成机理不常见,研究结论对改进塑封器件生产工艺具有参考价值。
Destructive physical analysis (DPA) of the plastic encapsulated devices revealed that there was metallization damage on the surface of the sample chip. Backscattered electron imaging and energy spectrum analysis of the damaged sites confirmed the presence of steel particles in the damaged sites. Combined with the plastic packaging process further analysis of the damage morphology, the results show that the steel particles from plastic mold damage or aging, the stress generated in the epoxy curing process leads to the crushing of the metal layer of steel particles. The damage of plastic encapsulated devices with such defects in high reliability applications is analyzed. The formation mechanism of such defects is not common, the conclusions of the study have a reference value for improving the production process of plastic encapsulated devices.