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介绍了在谐振器结构释放后的干燥过程中,采用的一种有效的、防粘附的方法———升华法。在升华法的基础上,开发了充分置换升华法,对若干种释放方法进行实验、比较,确定了充分置换法的更优性;并找出了影响分离长度的因素,为提高结构释放产品率奠定了基础。
An effective and anti-adhesion method --- sublimation method was introduced in the drying process after the resonator structure was released. On the basis of the sublimation method, a full displacement sublimation method was developed, a number of different release methods were tested and compared to determine the better replacement method, and the factors affecting the separation length were found. In order to improve the structure release rate Foundation.