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在LCP薄膜化学镀期间施加超声波处理,研究处理前后镀铜层表面形貌及镀层的结合力和电阻率。研究发现:超声波处理使铜层颗粒细小、致密,显著提高镀层的结合力;超声波处理超过2 min可降低表面镀层的电阻率;超声波处理使铜层颗粒细小、致密,是引起铜层结合力提高和电阻率降低的原因。热处理可进一步提高铜层和LCP膜间的结合力,这是热处理导致LCP产生蠕变使其与铜层间压力增加的结果。
During the electroless plating of LCP film, ultrasonic treatment was applied to study the surface topography of the copper plating layer before and after treatment and the adhesion and resistivity of the plating layer. The results show that ultrasonic treatment can make the copper particles small and dense, and significantly improve the adhesion of the coating. Ultrasonic treatment for more than 2 min can reduce the resistivity of the surface coating. Ultrasonic treatment causes the copper particles to be small and dense, And the reason for the decrease in resistivity. Heat treatment can further increase the bond between the copper layer and the LCP film as a result of the heat treatment that causes the creep of the LCP to increase the pressure on the copper layer.