论文部分内容阅读
上无二十厂首次试制成功一种软性印制线路板,最近通过了技术鉴定,并已投入批量生产.软性印制线路板是国际上六十年代开始研制和应用的一种新技术,过去国内尚属空白. 软性印制线路板采用聚酰亚胺或聚酯薄膜作为绝缘基底(厚度0.05～0.10毫米),复上导电体铜箔(厚度0.05毫米),经过感光腐蚀法制成.导电体抗剥强度不小于1.2公斤/厘米;耐浸焊性可达260℃高温;在曲折半径不小于1毫米时,可重复弯折20次,导电
On the first trial of a success of a non-twenty plant a flexible printed circuit board, recently passed the technical appraisal, and has been put into mass production. Soft Printed Circuit Board is the international sixties began to develop and apply a new technology , In the past is still blank in the country.Soft printed circuit board with polyimide or polyester film as the insulation substrate (thickness of 0.05 to 0.10 mm), complex conductive copper foil (thickness of 0.05 mm), made by photosensitive etching Anti-peel strength of conductor not less than 1.2 kg / cm; Solderability solder up to 260 ℃ high temperature; bending radius of not less than 1 mm, can be folded repeatedly 20 times, conductive