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以纳米级MgO颗粒为增强相,采用SPS法(Spark Plasma Sintering)制备了体积分数为1%、3%、5%、8%的MgO/Cu复合材料,并在JF04C电接触触点材料测试系统上进行了抗电弧侵蚀性能测试。结果表明,随着MgO含量的增加,MgO/Cu复合材料的相对密度和电导率降低,硬度先升高后降低,材料质量转移量逐渐减小,抗电蚀性能逐渐提高,其中MgO含量为5%时,综合性能最好,硬度(HV)达到110,电导率为45.24 MS/m,抗电蚀性能转移量为0.1 mg。组织观察表明,MgO颗粒含量为1%~5%时,颗粒在基体内分布均匀致密、晶粒细小,触头表面熔化程度逐渐减小,而当MgO含量达到8%时,MgO颗粒在铜基体中出现一定程度的团聚,这也是影响MgO/Cu复合材料综合性能变化的主要原因。
The MgO / Cu composites with 1%, 3%, 5%, 8% MgO particles were prepared by Spark Plasma Sintering (SPS) with nano-scale MgO particles as the reinforcing phase. The JF04C electrical contact material testing system On the anti-arc erosion performance test. The results show that with the increase of MgO content, the relative density and electrical conductivity of MgO / Cu composites decrease, the hardness first increases and then decreases, the mass transfer of materials gradually decreases, and the corrosion resistance increases gradually. The content of MgO is 5 %, The best overall performance, hardness (HV) reached 110, the conductivity of 45.24 MS / m, anti-corrosion performance of the transfer amount of 0.1 mg. The microstructure observation shows that when the content of MgO particles is 1% ~ 5%, the particles are evenly distributed in the matrix, the grains are small and the melting degree of the contact surface decreases gradually. When MgO content reaches 8% In a certain degree of reunion, which is also the main reason for the changes in the overall performance of MgO / Cu composites.