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设计了不同厚度的Ni中间层,采用阶梯式真空扩散连接工艺方法,对Cu/Al的异质复合界面组织形貌及冶金反应进行了研究。利用扫描电镜(SEM)及能谱(EDS),对异质复合界面的微观组织进行了分析,采用剪切试验及显微硬度测试对异质复合界面的结合强度及硬度分布进行了研究。结果表明,Ni中间层可阻止Cu和Al间生成脆性金属间化合物,其中Ni/Al界面生成了明显的两层Al3Ni和Al3Ni2化合物,而Cu/Ni界面出现了明显的元素成分渐变的固溶体相;当添加Ni箔厚度为20μm时,Ni箔刚好消耗完,连接界面无明显缺陷,且界面的剪切强度最高。
Different thicknesses of Ni intermediate layer were designed and the heterogeneous composite interface morphology and metallurgical reaction of Cu / Al were studied by stepped vacuum diffusion bonding process. The microstructure of the heterogeneous composite interface was analyzed by scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The shear strength and hardness distribution of the heterogeneous composite interface were studied by shear test and microhardness test. The results show that the Ni intermediate layer can prevent the formation of brittle intermetallic compounds between Cu and Al, in which two layers of Al3Ni and Al3Ni2 compounds are obviously formed on the Ni / Al interface and the obvious solid solution phase appears on the Cu / Ni interface. When Ni foil thickness is added to 20μm, Ni foil just finished, no obvious interface defects, and the interface of the highest shear strength.