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在纳米工艺水平下,传统的铜线互连已经很难满足集成电路芯片在延迟、带宽、功耗等方面的要求,片内通信问题已经成为集成电路设计的瓶径。文中根据片内光器件集成技术的最新进展,介绍了采用片内光互连代替电互连的最新技术及其性能方面的优势。文中重点总结了片内光互连的三种典型应用。首先,介绍了片内光时钟分布网络;其次,从应用的角度分析了光电总线结构相对于单纯电总线在性能上的提升;最后,介绍了一种新的片上光网络,它集成了片内电的包交换控制网络和宽带电路交换光网络。仿真和实验结果表明,光互连能够为高集成度纳米级芯片提供高带宽、低延迟、小功耗的片内通信服务。
At the level of nano-technology, the traditional interconnection of copper wire has been difficult to meet the requirements of the integrated circuit chip in terms of delay, bandwidth, power consumption and the like, and the intra-chip communication problem has become the bottleneck of integrated circuit design. According to the latest development of on-chip optical device integration technology, this paper introduces the latest technology of using optical interconnects instead of electrical interconnects and its performance advantages. The paper mainly summarizes three typical applications of on-chip optical interconnects. First of all, the on-chip optical clock distribution network is introduced. Secondly, the performance of the optical bus structure relative to pure electric bus is analyzed from the application point of view. Finally, a new on-chip optical network is introduced, which integrates on-chip Electric Packet Exchange Control Network and Broadband Circuit Switched Optical Network. Simulation and experimental results show that the optical interconnection can provide high-bandwidth, low-latency and low-power on-chip communication services for highly integrated nano-scale chips.