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蓝宝石具有高耐磨性、高硬度、高熔点及化学性能稳定等特点,是重要的光学元件和半导体衬底材料,广泛应用于工业、国防和科研等领域。传统的机械加工易产生裂纹、碎片和刀具易磨损等问题,化学刻蚀法的加工效率又较低。因此采用波长为1 064nm的纳秒脉冲红外激光,以CuSO4溶液作为工作液,对激光诱导背面湿式刻蚀蓝宝石技术进行了加工工艺研究,并利用共聚焦显微镜对激光加工后蓝宝石沟槽表面的形貌尺寸进行检测。同时通过单因素实验法研究了脉冲激光能量与扫描速度、重复次数、刻蚀液浓度以及液膜厚度对划槽尺寸和划槽质量的影响规律。实验表明使用20%的饱和CuSO4溶液,在0.5~0.9J/mm的线密度能量下8次扫描,并使用430~1 400μm的液层厚度有利于提高激光诱导液相沉积量,加大激光划切深度,获得质量较好的划槽。
Sapphire has the characteristics of high abrasion resistance, high hardness, high melting point and stable chemical property. It is an important optical element and semiconductor substrate material and widely used in the fields of industry, national defense and scientific research. The traditional mechanical processing is easy to produce cracks, debris and easy to wear and other issues, the chemical etching method of processing efficiency and lower. Therefore, a nanosecond pulsed infrared laser with a wavelength of 1,064 nm was used, and a CuSO4 solution was used as a working solution to process laser-induced back-side wet-etching sapphire technology. The shape of the surface of the sapphire trench after laser processing was analyzed by using a confocal microscope Appearance size test. At the same time, the effects of pulse laser energy and scanning speed, repetition times, etching solution concentration and film thickness on scribe size and scribing quality were studied by single factor experiment. Experiments show that the use of 20% saturated CuSO4 solution at a linear density of 0.5 ~ 0.9J / mm 8 times the scan energy and the use of liquid layer thickness of 430 ~ 1400μm is conducive to increasing the amount of laser-induced liquid deposition, increase the laser draw Cut depth, get better quality slot.