采用常温、常压分子动力学模拟技术 ,研究了在周期性边界条件下 ,由 86 4个Cu原子构成的模型系统的熔化、结晶过程。原子间相互作用势采用EAM势。模拟结果表明 :在连续升温过程中 ,金属Cu在 152 0K熔化 ;以不同的冷速进行冷却 ,在较慢冷却条件下 ,液态Cu在 10 10K结晶 ;当冷速较快时 ,液态Cu形成非晶态。分析了升降温过程中熔体偶分布函数、原子体积、能量、MSD随温度的变化特征 The melting and crystallization processes of a model system composed of 864 Cu atoms at periodic boundary conditions were studied by using the molecular dynamics simulations at room temperature and atmospheric pressure. Interaction potential between atoms using EAM potential. The simulation results show that Cu is melted at 152 0 K during continuous heating and cooled at different cooling rates. Under slow cooling conditions, liquid Cu crystallizes at 10 10 K. When the cooling rate is fast, Crystalline. The analysis of the even distribution function, atomic volume, energy, MSD variation with temperature