台湾成功大学研究团队研发半导体封装的新材料,价格低、性质更稳定,将成为半导体界最先进优良的材料。笔电、手机等3C产品都需要半导体晶片,而半导体晶片要变成电子元件就必须透过封装的过程。成功大学材料科学及工程系教授林光隆领导的研究团队研发以(锡—锌—银—铝—镓)为主要成分的新材料,比目前业界使用的(锡—银—铜)材料价格更低,性质也更稳定。林光隆表示,现行采用(锡—银—铜)材料,受到铜的价格飙高影响,材料成 Taiwan’s successful university research team to develop semiconductor packaging of new materials, low prices, more stable nature, will be the semiconductor industry’s most advanced and excellent materials. 3C products such as notebooks and mobile phones require semiconductor chips, and semiconductor chips must be encapsulated by electronic components. A research team led by Lim Keng Loong, a professor of Materials Science and Engineering at the University of Success, developed a new material based on (tin-zinc-silver-aluminum-gallium) that is cheaper than the currently used (tin- silver- copper) materials , The nature is more stable. Lin Guanglong said that the current use of (tin - silver - copper) material, subject to soaring copper prices affect the material into