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以钛粉、硅粉、炭黑为主要原料,利用热压烧结技术制备SiC/Ti_3SiC_2复合材料。借用扫描电镜和X射线衍射,探索SiC对复合材料的相组成、组织结构、力学性能及电导率的影响。结果表明:在25 MPa压力下,热压烧结1 500℃,可制备高致密、均匀的复合材料;SiC对提高SiC/Ti_3SiC_2复合材料的相组成、力学性能有很大影响,当碳化硅质量分数为20%,复合材料弯曲强度为373 MPa,断裂韧性为5.4 MPa·m1/2,材料性能得到明显提高;纯样Ti_3SiC_2材料的电导率最强,为4.18 MS/m。在基体中,Ti_3SiC_2层状晶粒相互交错形成连续的网状结构,Ti_3SiC_2作为导电颗粒转移的电子越多,试样电导率越高。
Using titanium powder, silicon powder and carbon black as main raw materials, SiC / Ti_3SiC_2 composites were prepared by hot pressing sintering technology. By scanning electron microscopy and X-ray diffraction, the effects of SiC on the phase composition, microstructure, mechanical properties and electrical conductivity of the composites were investigated. The results show that hot pressing and sintering at 1500 ℃ can produce high density and uniform composite materials. SiC has great influence on the phase composition and mechanical properties of SiC / Ti_3SiC_2 composites. When the mass fraction of silicon carbide Is 20%, flexural strength of the composite is 373 MPa, fracture toughness is 5.4 MPa · m1 / 2, and the material properties are obviously improved. The pure conductivity of Ti3SiC2 material is the strongest, 4.18 MS / m. In the matrix, Ti_3SiC_2 layered grains interlaced to form a continuous network structure, Ti_3SiC_2 as conductive particles transfer more electrons, the higher the conductivity of the sample.