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研究150°C等温时效对Sn-6.5Zn/Cu焊点微观结构特征与显微硬度的影响,分析界面金属间化合物的形成与演变机制。结果表明:Sn-6.5Zn/Cu焊点界面化合物层由CuZn和Cu5Zn8组成;随着等温时效时间的延长,化合物层的厚度表现为先增大、后减小的趋势;长时间的高温时效会导致Cu-Zn金属间化合物的分解,并破坏界面连续致密的化合物层。在局部破坏的界面区Cu基体处形成不连续的Cu6Sn5化合物层;时效后界面粗化并形成明显的孔洞。时效导致界面显微硬度不同程度的增大。
The effects of 150 ℃ isothermal aging on the microstructure and microhardness of Sn-6.5Zn / Cu solder joint were studied. The formation and evolution mechanism of interface intermetallic compounds were analyzed. The results show that the compound layer of Sn-6.5Zn / Cu solder joint interface consists of CuZn and Cu5Zn8. With the increase of isothermal aging time, the thickness of compound layer first increases and then decreases; the long-term aging of high temperature Resulting in the decomposition of the Cu-Zn intermetallic compound and breaking down the continuous compact interface layer. A discontinuous Cu6Sn5 compound layer was formed on the Cu substrate in the locally damaged interface area. After aging, the interface roughened and obvious voids were formed. Aging results in varying degrees of microhardness of the interface.