Preliminary Process Design of ITER ELM Coil Bracket Brazing

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With the technical requirement of the International Thermonuclear Experimental Reactor(ITER) project,the manufacture and assembly technology of the mid Edge Localized Modes(ELM) coil was developed by the Institute of Plasma Physics,Chinese Academy of Science(ASIPP).As the gap between the bracket and the Stainless Steel jacketed and Mineral Insulated Conductor(SSMIC) can be larger than 0.5 mm instead of 0.01 mm to 0.1 mm as in normal industrial cases,the process of mid ELM coil bracket brazing to the SSMICT becomes quiet challenging,from a technical viewpoint.This paper described the preliminary design of ELM coil bracket brazing to the SSMIC process,the optimal bracket brazing curve and the thermal simulation of the bracket furnace brazing method developed by ANSYS.BAg-6 foil(Bag50Cu34Zn16) plus BAg-la paste(Bag45CuZnCd) solders were chosen as the brazing filler.By testing an SSMICT prototype,it is shown that the average gap between the bracket and the SSMIC could be controlled to 0.2-0.3 mm.and that there were few voids in the brazing surface.The results also verified that the preliminary design had a favorable heat conducting performance in the bracket. With the technical requirement of the International Thermonuclear Experimental Reactor (ITER) project, the manufacture and assembly technology of the mid Edge Localized Modes (ELM) coil was developed by the Institute of Plasma Physics, Chinese Academy of Science (ASIPP). As the gap between the bracket and the Stainless Steel jacketed and Mineral Insulated Conductor (SSMIC) can be larger than 0.5 mm instead of 0.01 mm to 0.1 mm as in normal industrial cases, the process of mid ELM coil bracket brazing to the SSMICT becomes quiet challenging, from a technical view. This paper describes the preliminary design of ELM coil bracket brazing to the SSMIC process, the optimal bracket brazing curve and the thermal simulation of the bracket furnace brazing method developed by ANSYS. BAg-6 foil (Bag50Cu34Zn16) plus BAg-la paste (Bag45CuZnCd) solders were chosen as the brazing filler. By testing an SSMICT prototype, it is shown that the average gap between the bracket and the SSMIC could be controlled to 0.2- 0.3 mm.and that there were few voids in the brazing surface. The results also verified that the preliminary design had a favorable heat conducting performance in the bracket.
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