论文部分内容阅读
HDI板导通孔结构对印制板设计灵活性、局限性和成本的影响HDI Via Structures Effecton PCB Design Flexibility,Con-straintsand Cost文章分析了HDI板导通孔不同结构对设计密度与产品成本的影响,主要叙述了四种导通孔结构形式:钻孔贯通型、微孔叉位积层型、微孔重叠积层型和全微孔连接积层型。对四种导通孔结构形式作了具体介绍,并列表比较了它们的性能特点、制造能力和生产成本等,为HDI板的可制造性设计(DfM)提供了很好依据。(Happy Holden,PCD&Fab,2007/11,共7页)
Effects of HDI Board Via Structure on Printed Board Design Flexibility, Limitations and Costs HDI Via Structures Effecton PCB Design Flexibility, Con-straints and Cost The article analyzes the effect of different configurations of HDI board vias on design density and product cost , Mainly describes the structure of four types of vias: Drill through type, micro-hole fork stacked type, micro-porous laminated type and full-micro-hole connection laminated type. The four types of vias are introduced in detail, and their performance characteristics, manufacturing capabilities, manufacturing costs and so on are compared and listed, providing a good basis for the design of manufacturability (DfM) of HDI boards. (Happy Holden, PCD & Fab, 2007/11, 7 pages)