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一、前言最近几年来,由于半导体工艺的不断革新,半导体存贮器得到很快发展。在半导体随机存贮器中,主要生产和发展的是MOS动态随机存贮器,因为它面积小,工艺简单,集成度大,而且成本便宜。静态单元在1965年已做出来了,它只得到了少量的发展;动态单元因工艺的原因,一直到1967年才出现,真正生产是在1970年下半年。半导体随机存贮器开始时在微型计算机和中规模集成的计算机中用作主存贮器;最近在大型的计算机中,如IBM370中亦开始作为主存贮器使用。因此,它已显示出有代替磁芯作主存贮
First, the foreword In recent years, due to the continuous innovation of semiconductor technology, semiconductor memory has been rapid development. In the semiconductor random access memory, the main production and development of MOS dynamic random access memory, because of its small size, simple process, integrated, and low cost. The static cell was made in 1965, and it only received a small amount of development; the dynamic cell did not show up until 1967 due to technology, and the real production was in the second half of 1970. Semiconductor RAMs are initially used as main memory in microcomputers and medium-scale integrated computers; recently they have also been used as main memory in large computers such as the IBM 370. Therefore, it has been shown that there is a replacement for core storage