最近,松下公司发表了可以采用现行的曝光方法和光致抗蚀剂以满足制作高密度LSI要求的腐蚀技术。它不仅作到了倾斜腐蚀,而且成功地研究了用离子注入技术进行精密腐蚀的新方法。研制超LSI的国家把如何提高电路的规模归结为微细加工技术的研究。特别是对各种曝光方法和优质光致抗蚀剂材料的研究二者是同时并重的,然而同时发挥这二者作用的光刻技术的重要性却常常被忽视。松下公司新的光刻方法在这一点上是引人注目的。虽然现在的光刻加工精度已经大为提高,但其中电极布线材料(A1、多晶硅等)的加工技术仍是重要的研究课题。加工时的主要问题大体上有二个:(1)衬底的 Recently, Matsushita has published corrosion technologies that can use current exposure methods and photoresists to meet the needs of high-density LSIs. Not only has it been tilted and corroded, but it has also successfully studied new methods of precision etching using ion implantation. The countries that develop ultra LSI attributed to how to improve the scale of the circuit for the study of micro-processing technology. In particular, research on various exposure methods and high-quality photoresist materials are both simultaneously important. However, the importance of the lithography technique that simultaneously functions both is often overlooked. Panasonic's new lithography approach is compelling at this point. Although the lithography processing accuracy has been greatly improved, the processing technology of the electrode wiring materials (A1, polysilicon, etc.) is still an important research topic. The processing of the main problems are generally two: (1) the substrate