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目前,现代化半导体制造工业的工艺技术不仅需要简化操作,经济易行,而且还应是高可靠和高性能的。最近推出的新系列光敏性聚酰亚胺产品同时具有聚酰亚胺的高温稳定性和负性光刻胶性能的特点。由于这类聚酰亚胺具有感光性,因此使用时不需单独进行光刻,使用者不需多次操作就能在聚酰亚胺膜上形成精细的微电路图形。聚酰亚胺之所以在微电子工业中引起人们的极大兴趣,是由于它具有介电常数低、高温稳定性好及理想的平坦性等优点。其耐热温度可达400℃。表Ⅰ列出了一种经充分固化后的光敏性聚酰亚胺的典型物理参数。
At present, the process technology of the modernized semiconductor manufacturing industry not only needs to simplify the operation, is economical and feasible, but also should be highly reliable and high-performance. Recently introduced a new series of photosensitive polyimide products also have the high temperature stability of polyimide and negative photoresist properties. Because of their photosensitivity, these polyimides do not require separate lithography to be used, allowing the user to create a fine microcircuit pattern on a polyimide film without requiring multiple operations. The reason why polyimide has drawn great interest in the microelectronics industry is that it has the advantages of low dielectric constant, good high temperature stability and ideal flatness. The heat-resistant temperature up to 400 ℃. Table I shows typical physical parameters of a fully cured photo-sensitive polyimide.