论文部分内容阅读
自去年7月以来,三菱电机发布了一系列碳化硅(SiC)功率模块,这些产品将于今年6月18日至20日在上海世博展览馆举行的“PCIM亚洲展2013”中隆重亮相。众所周知,目前市场上采用的功率模块的IGBT芯片大多采用硅材料制造,
Since July last year, Mitsubishi Electric has released a series of silicon carbide (SiC) power modules that will be unveiled at the PCIM Asia Expo 2013 in Shanghai World Expo Exhibition Center from June 18 to June 20 this year . As we all know, the power module currently used in the market of IGBT chips are mostly made of silicon materials,