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建立强制空气对流冷却多个电子芯片的理论模型,采用控制容积法离散控制方程组并进行数值求解,得到芯片和固体基板的温度场,分析了冷却空气流过电子芯片的流场,同时在考虑芯片与基板的接触热阻的情况下,计算了芯片的温度分布,并与不考虑其接触热阻的数值模拟结果进行了比较。研究表明离冷却空气进口最远的芯片温度最高;空气在芯片之间流动会产生回流现象;当电子芯片与固体基板接触热阻较小时,芯片工作产生的热量能很好地通过固体基板传递出去,而当电子芯片与固体基板接触热阻较大时,热量传递会相对困难,使得芯片工作时产生的热量不能及时带走,芯片容易超温工作。
The theoretical model of forced air convection cooling of multiple electronic chips is established. The governing volume method is used to discretely control equations and numerical solution. The temperature field of chip and solid substrate is obtained. The flow field of cooling air flowing through the electronic chip is analyzed. In the case of the contact thermal resistance between the chip and the substrate, the temperature distribution of the chip is calculated and compared with the numerical simulation without considering the thermal contact resistance. Research shows that the temperature of the chip farthest from the inlet of the cooling air is the highest; the air flows back and forth between the chips, and when the thermal contact resistance between the electronic chip and the solid substrate is small, the heat generated by the chip can be well transferred out through the solid substrate , And when the thermal contact resistance between the electronic chip and the solid substrate is large, the heat transfer will be relatively difficult, so that the heat generated during the operation of the chip can not be taken away in time and the chip is easily over-heated.