溅射钽环件应用于半导体制造的金属化工艺,其作用是在溅射过程中起到聚焦和净化的作用。钽凸台是溅射钽环件的主要部件,其材料利用率以及加工效率对溅射钽环件的加工成本影响很大。采用先挤压成型后机械加工的新工艺代替国外全部采用机械加工的工艺,将材料利用率由41.96%提高到77.90%,并且极大地提高了加工效率。这种新工艺的主要难点是模具结构设计、模具材料选择以及原材料的制备。这种新工艺已得到实践验证,产品完全满足国外用户的要求。 Sputtered tantalum ring components used in semiconductor manufacturing metallization process, its role is to play during the sputtering focus and purification role. Tantalum bosses are the main components of sputtered tantalum rings and their material utilization and processing efficiency have a significant impact on the processing costs of sputtered tantalum rings. The use of new technology after the first extrusion machining machining instead of using all mechanical processing technology, the material utilization from 41.96% to 77.90%, and greatly improve the processing efficiency. The main difficulties of this new process are mold structure design, mold material selection and raw material preparation. This new process has been proven, the product fully meet the requirements of foreign users.