论文部分内容阅读
采用交流阻抗谱研究了无电镀镍浸金处理电路板在模拟电解质溶液(0.1mol·L-1NaHSO3)中的电化学腐蚀行为,并结合体视学显微镜、扫描电镜、X射线能谱分析等手段分析了试样表面腐蚀产物形貌、组成和镀层失效机制.无电镀镍浸金处理电路板在NaHSO3溶液中的耐蚀性较差,浸泡12h试样表面局部即发生变色,伴随有微裂纹的产生.电解液能够通过裂纹直接侵蚀Cu基底,并在微裂纹周围生成较多的枝晶状结晶产物,其主要组分为Cu2S.该结晶腐蚀产物的不断生成使局部区域中间Ni过渡层与Cu基底结合部位存在较大的横向剪切应力,最终造成Ni镀层的脱离与鼓泡现象.
The electrochemical corrosion behavior of electroless nickel-immersion gold immersion circuit boards in simulated electrolyte solution (0.1mol·L-1NaHSO3) was studied by AC impedance spectroscopy. Combined with stereomicroscope, scanning electron microscopy and X-ray energy spectrum analysis The morphology, composition and coating failure mechanism of the corrosion products on the surface of the sample were analyzed.The corrosion resistance of the electroless nickel immersion gold immersion circuit board in NaHSO3 solution was poor, and the surface of the sample immersed for 12h was discolored locally with microcracks . The electrolyte can directly attack the Cu substrate through the cracks and generate more dendrite products around the micro-cracks, and the main component is Cu2S. The continuous production of the crystalline corrosion products makes the intermediate Ni transition layer in the local area and Cu Substrate binding site there is a large horizontal shear stress, eventually resulting in Ni plating detachment and bubbling phenomenon.