采用Cu46Zr46Al8非晶薄片作为连接中间层,在温度750～900℃、压力0.5 MPa、保温时间300 s条件下,对纯Cu进行瞬时液相扩散连接,采用扫描电镜(SEM)和能谱仪(EDS)对连接层组织和成分分布进行了分析,并对连接试样的力学性能进行了测试。结果表明,连接界面结合良好,当连接温度较低时(750～800℃),基体与连接界面层发生了扩散反应,形成了3层Cu-Zr金属间化合物反应层;当连接温度在850～900℃时,基体以胞状生长方式长入中间层,而中间层凝固成片层状共晶组织(Cu9Zr2和Cu)。900℃连接试样的抗拉强度为345 MPa,表现出良好的塑性。 Cu46Zr46Al8 amorphous thin film was used as the connecting intermediate layer. Pure Cu was transiently liquid-phase diffusion bonded at 750-900 ℃, 0.5 MPa and holding time of 300 s. Scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS) ) To analyze the microstructure and composition distribution of the tie layer, and to test the mechanical properties of the connected samples. The results show that the bonding interface is well bonded. When the bonding temperature is low (750-800 ℃), the diffusion reaction occurs between the bonding layer and the interface layer to form three layers of Cu-Zr intermetallic compound reaction layer. When the bonding temperature is between 850 ~ At 900 ℃, the matrix grows into the middle layer in the form of cell growth, while the middle layer solidifies into lamellar eutectic structure (Cu9Zr2 and Cu). The tensile strength of the sample bonded at 900 ℃ is 345 MPa, showing good ductility.