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针对静电吸附在微电子机械系统(MEMS)器件装配线中的潜在应用,试图研制一种单位面积上吸附力大和自身面积小的低工作电压静电吸片。通过介绍静电吸附现象的应用与传统静电吸盘,提出一种采用表面微加工工艺制作的双极性静电吸片。在分析静电吸片的结构与工作原理基础上,采用微加工工艺制备静电吸片,其中关键是在金属电极层上溅射法制备介质薄膜,之后采用微拉伸装置测量静电吸片的切向吸附力。实验结果表明:切向吸附力随着电极间隙的减小而增大;当施加电压150 V时,利用电极间隙为40μm的方形环式静电吸片吸附面积为4 mm×4 mm的硅片,最大切向吸附力为15 mN,即剪切压强为0.94 kPa,能够完成微器件的拾取与固定。
In view of the potential application of electrostatic adsorption in microelectromechanical system (MEMS) device assembly line, an attempt was made to develop a low working voltage electrostatic chuck with large adsorption force and small area per unit area. By introducing the application of electrostatic adsorption phenomenon and the traditional electrostatic chuck, a bipolar electrostatic chuck fabricated by surface micromachining technology is proposed. Based on the analysis of the structure and working principle of the electrostatic chuck, the micro-fabrication process is used to prepare the electrostatic chuck. The key is to prepare the dielectric film by sputtering on the metal electrode layer, and then use the micro-stretching device to measure the tangential direction of the electrostatic chuck Adsorption force. The experimental results show that the tangential adsorptive force increases with the decrease of the electrode gap. When the voltage is 150 V, the area of 4 mm × 4 mm silicon wafer is adsorbed by the square ring electrostatic chuck whose electrode gap is 40 μm, Maximum tangential adsorption force of 15 mN, that is, the shear pressure of 0.94 kPa, to complete the micro-device pick and fixed.