智能材料中的形状记忆聚合物(SMP)正获得越来越多的研究和应用,本文的主要工作是在Ansys的基础上利用粘弹性模拟形状记忆聚合物。来模拟形状记忆聚合物在形状记忆过程中的应变-应力关系、温度-应变关系、温度应力关系,研究温度对形状记忆聚合物材料模量的影响,并研究形状记忆聚合物在形状恢复过程中的影响因素。 Shape memory polymers (SMPs) in smart materials are gaining more and more research and applications. The main work of this paper is to use viscoelastic simulation of shape memory polymers based on Ansys. To simulate the strain-stress relationship, temperature-strain relationship and temperature-stress relationship of shape memory polymer during shape memory, and to study the effect of temperature on the modulus of shape memory polymer. The effect of shape memory polymer on shape recovery The impact of factors.